Rapid PCB Prototyping
If you are introducing a new product, PCB prototyping is the easiest and cost-effective way of detecting and fixing errors. It enables the reduction of the risk of costly rework during mass production.
We offer quick prototype-making service and reverse engineering of existing assemblies.
- Online Support 24/7
- 24 hours fast PCB prototype expedite services
- Free DFM & DFA Check
- No minimum order requirement
PCB Reverse Engineering
We also offer reverse engineering of existing assemblies.
We can take an existing board from a bare board, an assembled board, existing drawings, and we can create a new design with all supporting documentation.
PCB Prototype Capability
Follows are basic PCB production capability, but we are not limited by that
| Item | Capabilities |
|---|---|
Layer Count | 1 – 32 Layers |
Max Board Dimension | 24*24″ (610*610mm) |
Min Board Thickness | 0.15mm |
Max Board Thickness | 6.0mm – 8.0mm |
Copper Thickness | Outer Layer:1oz~30oz, Inner Layer:0.5oz~30oz |
Min Line Width/Line Space | Normal: 4/4mil (0.10mm); HDI: 3/3mil (0.076mm) |
Min Hole Diameter | Normal: 8mil (0.20mm) ; HDI: 4mil (0.10mm) |
Min Punch Hole Dia | 0.1″ (2.5mm) |
Min Hole Spacing | 12 mil (0.3mm) |
Min PAD Ring(Single) | 3mil (0.075mm) |
PTH Wall Thickness | Normal: 0.59mil (15um); HDI: 0.48mil (12um) |
Min Solder PAD Dia | Normal: 14mil (0.35mm); HDI: 10mil(0.25mm) |
Min Soldermask Bridge | Normal: 8mil (0.2mm); HDI: 6mil (0.15mm) |
Min BAG PAD Margin | 5mil (0.125mm) |
PTH/NPTH Dia Tolerance | PTH: ± 3mil (0.075mm) ; NPTH: ±2 mil (0.05mm) |
Hole Position Deviation | ±2 mil (0.05mm) |
Outline Tolerance | CNC: ± 6mil (0.15mm); Die Punch: ± 4mil (0.1mm); Precision Die: ± 2mil (0.05mm) |
Impedance Controlled | Value>50ohm: ±10%; Value≤50ohm: ±5 ohm |
Max Aspect Ratio | 8:1 |
Surface Treatment | ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger, Selected Gold plating,ENEPIG, ENIPIG; HAL, HASL(LF), OSP, Silver Imm., Tin Imm |
Soldermask Color | Green/White/Black/Yellow/Blue/Red |
| Item | Capabilities |
|---|---|
Layer Count | 1 – 10 Layers |
Max Board Dimension | 24*64″(610*1625mm) |
Min Board Thickness | 0.6mm |
Max Board Thickness | 4.0mm |
Conductor Thickness | 0.5oz – 10oz |
Min Line Width/Line Space | 4/4mil (0.10/0.10mm) |
Min Hole Diameter | 10mil (0.25mm) |
Min Punch Hole Dia | 0.12″ (3.0mm) |
Min Hole Spacing | 16mil (0.4mm) |
Min PAD Ring(Single) | 3mil (0.075mm) |
PTH Wall Thickness | Normal: 0.59mil (15um); HDI: 0.48mil (12um) |
Min Solder PAD Dia | 14mil (0.35mm) |
Min Soldermask Bridge | 8mil (0.20mm) |
Min BAG PAD Margin | 5mil (0.125mm) |
PTH/NPTH Dia Tolerance | PTH: ±3 mil (0.075mm); NPTH: ±2mil (0.05mm) |
Hole Position Deviation | ±3mil (0.075mm) |
Outline Tolerance | CNC: ±6 mil (0.15mm); Die Punch: ±6 mil (0.1mm) |
Max Aspect Ratio | 10:1 |
Surface Treatment | ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger, Selected Gold Plating, ENEPIG, ENIPIG, HAL, HASL(LF), OSP, Silver Imm., Tin Imm |
| Item | Thick Film Capabilities | DCB/DBC Capabilities | DPC Capabilities | AMB Capabilities |
|---|---|---|---|---|
Layer Count | 10 Layers | 2 Layers | 2 Layers | 2 Layers |
Max Board Dimension | 138*190mm | 138*178mm | 138*190mm | 114*114mm |
Min Board Thickness | 0.25mm | 0.30mm – 0.40mm | 0.25mm | 0.25mm |
Max Board Thickness | 2.0mm | 1L: 1.3mm; 2L 1.6mm | 2.0mm | 1.8mm |
Conductor Thickness | 5um – 13um | 0.10mm – 0.30mm | 2um – 200um | 0.25mm – 0.80mm |
Min Line Width/Line Space | 6/8mil (0.15/0.20mm) | 12/12mil (0.30/0.30mm) | 6/8mil (0.15/0.20mm) | 20/20mil (0.50/0.50mm) |
Substrate Type | Al2O3, AIN, BeO, ZrO2 | Al2O3, AIN, ZrO2 | Al2O3, AIN, ZrO2, Si3N4 | Al2O3, AIN, Si3N4 |
Substrate Thickness | 0.25, 0.38, 0.50, 0.635, 0.80, 1.0, 1.5, 2.0mm | 0.25, 0.38, 0.50, 0.635, 0.76, 1.0, 1.5, 2.0mm | 0.25, 0.38, 0.50, 0.635, 0.80, 1.0, 1.5, 2.0mm | 0.25, 0.38, 0.50, 0.635, 0.76, 1.0mm |
Min Hole Diameter | 4mil (0.1mm) | |||
Min Hole Spacing | NPTH: 16mil (0.30mm); PTH: 20mil (0.5mm) | |||
Min PAD Ring(Single) | 6mil (0.15mm) | N/A | 3mil (0.075mm) | N/A |
PTH Wall Thickness | 4mil (10um) | N/A | 4mil (10um) | N/A |
Min Solder PAD Dia | 10mil (0.25mm) | 8mil (0.20mm) | 6mil (0.15mm) | 8mil (0.20mm) |
Min Soldermask Bridge | 12mil (0.30mm) | 8mil (0.20mm) | 6mil (0.15mm) | 8mil (0.20mm) |
Min BGA PAD Margin | 12mil (0.30mm) | 8mil (0.20mm) | 5mil (0.125mm) | 8mil (0.20mm) |
PTH/NPTH Dia Tolerance | PTH: ±4mil (0.1mm) ; NPTH: ±2mil (0.05mm) | |||
Hole Position Deviation | ± 4mil (0.1mm) | |||
Outline Tolerance | Laser: +0.20/-0.05mm | |||
Line Width/Spac Tolerance | ± 5mil (0.125mm) | ± 5mil (0.125mm) | ± 1mil (0.025mm) | ± 5mil (0.125mm) |
Surface Treatment | AgPd, AgPt, Au | OSP/Ni Plating/ENIG/ENEPIG | ||
Thermal Stress | 1 hour @ 350℃ | 3 x 10 Sec @ 280 ℃ | 15 min @ 350 ℃ | 3 x 10 Sec @ 280 ℃ |
| Item | Capabilities |
|---|---|
Layer Count | 1 – 30 Layers |
Max Board Dimension | 1L:500*2000mm; 2L:250*1380mm |
Min Board Thickness | 0.05mm |
Max Board Thickness | 3.0mm |
Conductor Thickness | 1/3 OZ(12 um) – 4OZ(140um) |
Min Line Width/Line Space | 2/2mil (0.05/0.05mm) |
Min Hole Diameter | 4mil (0.10mm) |
Min Hole Spacing | NPTH:16mil (0.4mm); PTH:20mil(0.5mm) |
Min PAD Ring(Single) | 3mil (0.075mm) |
PTH Wall Thickness | 0.59mil (15um) |
Min Solder PAD Dia | 10mil (0.25mm) |
Min Soldermask Bridge | 12mil (0.30mm) |
Min BAG PAD Margin | 12mil (0.30mm) |
PTH/NPTH Dia Tolerance | PTH: ±3mil (0.075mm); NPTH: ±2mil (0.05mm) |
Hole Position Deviation | ±4mil (0.10mm) |
Outline Tolerance | Laser: +0.15mm / -0.05mm; Die Punch: +0.10 / -0.20 mm |
Max Aspect Ratio | 8:1 |
Surface Treatment | ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold Finger, Selected Gold Plating, ENEPIG, ENIPIG |
Impedance Controlled | Value>50ohm: ±10%; Value≤50ohm: ±5 ohm |
| Item | Capabilities |
|---|---|
Layer Count | 2 – 50 Layers |
Max Board Dimension | 500*500mm |
Min Board Thickness | 0.30mm |
Max Board Thickness | 4.0mm |
Conductor Thickness | 0.5oz(18 um) – 2oz(70um) |
Min Line Width/Line Space | 3/3mil (0.075/0.075mm) |
Min Hole Diameter | 4mil (0.10mm) |
Min Hole Spacing | NPTH:16mil (0.4mm); PTH:20mil(0.5mm) |
Min PAD Ring(Single) | 3mil (0.075mm) |
PTH Wall Thickness | 0.59mil (15um) |
Min Solder PAD Dia | 10mil (0.25mm) |
Min Soldermask Bridge | 12mil (0.30mm) |
Min BAG PAD Margin | 12mil (0.30mm) |
PTH/NPTH Dia Tolerance | PTH: ±3mil (0.075mm); NPTH: ±2mil (0.05mm) |
Hole Position Deviation | ±4mil (0.10mm) |
Outline Tolerance | Laser: +0.15mm / -0.05mm; Die Punch: +0.10 / -0.20 mm |
Max Aspect Ratio | 8:1 |
Surface Treatment | ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold Finger, Selected Gold Plating, ENEPIG, ENIPIG |
Impedance Controlled | Value>50ohm: ±10%; Value≤50ohm: ±5 ohm |
Let’s work together
We will respond to you within 12 hours. Feel free to reach out to us for:
- Electronic project consultation
- New user question
- Professional engineer answers
- Get a quote