Our PCB Assembly Capacities
We offer consignment, full turnkey and partial turnkey assembly services.
We source all the parts directly from the manufacturers or from authorized distributors such as Digikey, Mouser,Future,TTI,Avnet and Arrow to avoid counterfeit parts.
We also warehouse a significant inventory of common parts.If we cannot source a specific component, our engineers will make recommendations for fair-price alternatives.
| Items | Capabilities |
|---|---|
Placer Speed | 13,200,000 chips/day |
Bare Board Size | 0.2 x 0.2 inches – 20 x 20 inches/ 22*47.5 inches |
Minimum SMD Component | 01005 |
Minimum BGA Pitch | 0.25mm |
Maximum Components | 50*150mm |
Assembly Type | SMT, THT, Mixed assembly |
Component Package | Reels, Cut Tape, Tube, Tray, Loose Parts |
Lead Time | 1 – 5 days |
PCB Assembly Process
A typical PCB assembly process consists of the following steps
Preparation Before Assembly Process
Check whether the raw materials, such as electronic components, are the same with the BOM list provided by customer, ensure the raw materials meet the customer’s requirement.
- DFA Checks
- Component Incoming Inspection
SMT & THT Assembly
Mounting of surface-mount components and through-hole components are completed after this stage.
- Fabricating the SMT Stencils
- Solder Paste Printing
- Solder Pasting Inspection
- SMD Components Placement
- Reflow Soldering
- AOI/X-Ray Inspection
- Through-Hole Component Insertion
Inspection and Testing
We strictly follow the international standards and customer standards to inspect and control the delivery quality.
- AOI/X-Ray Inspection
- Function Testing
- Final Inspection and Testing
- Cleaning and Drying
- Package and Delivery
How to ensure quality in PCB Assembly Service?
We conduct a full range of quality tests including:
Solder Paste Inspecting (SPI)
Solder Paste Inspection minimizing SMT board failures due to poor solder paste release.
Inspection Function:
It verifies the correct solder paste deposits for volume, area, height, offset and deformity to reduce solder joint defects.
Automatic Optic Inspection(AOI)
We use lastest 3D AOI which had much better ability than 2D/2.5D AOI to see the defect of components after SMT & THT.
Inspection Function:
open and short circuits, wrong polarity of components, misplaced or missing components, wrong orientation of IC packages, stains, cuts, scratches, insufficient solder paste, solder bridges, cracked solder joints, excess solder etc.
X-Ray Inspection
X-ray inspection inspects inside the board and inside all components on the board verifying all connections have been made accurately.
Inspection Function:
Open circuit, short circuit, defective or fault connection,welding line offset bridging,Solder joints empty inspection and measurement,Integrity inspection of solder ball in array package and chip covering packaging.
First Article Inspection (FAI)
before bulky production, we fabricate 5 pieces of PCBA first and randomly choose one piece for the FAI inspection.
If any issues arise during assembly, our FAI process will allow us to adjust our manufacturing equipment accordingly. After passing all quality checks, we will provide an FAI report for you to review and approve for bulky PCBA fabrication.
Functional Test
Functional testing imitate the real operating environment to verify their compliance with the design specification. It can also confirm the product performs in its intended environment.
Testing Reports
Upon request, we supply the following reports free of charge:
Download: Sample COC of New Spark Technology
- Solderbility Report
- Cross Section Reports
- First article inspection report
- Solder Paste Inspecting Report
- AOI report or visual inspection report
- Flying probe or in-circuit testing report
- Function testing report
Let’s work together
We will respond to you within 12 hours. Feel free to reach out to us for:
- Electronic project consultation
- New user question
- Professional engineer answers
- Get a quote