Ceramic PCB

Ceramic PCBs are widely used high-current LEDs, automobile industry , communications, audio amplifiers, solar cell substrates and many other sectors.

Ceramic PCB has the characteristics of higher operating temperature, lower expansion coefficient,good thermal properties,superior high-frequency performance and the ability to prevent the absorption of water.

Item	Capabilities
Layer Count	2 – 50 Layers
Max Board Dimension	500*500mm
Min Board Thickness	0.30mm
Max Board Thickness	4.0mm
Conductor Thickness	0.5oz(18 um) – 2oz(70um)
Min Line Width/Line Space	3/3mil (0.075/0.075mm)
Min Hole Diameter	4mil (0.10mm)
Min Hole Spacing	NPTH:16mil (0.4mm); PTH:20mil(0.5mm)
Min PAD Ring(Single)	3mil (0.075mm)
PTH Wall Thickness	0.59mil (15um)
Min Solder PAD Dia	10mil (0.25mm)
Min Soldermask Bridge	12mil (0.30mm)
Min BAG PAD Margin	12mil (0.30mm)
PTH/NPTH Dia Tolerance	PTH: ±3mil (0.075mm); NPTH: ±2mil (0.05mm)
Hole Position Deviation	±4mil (0.10mm)
Outline Tolerance	Laser: +0.15mm / -0.05mm; Die Punch: +0.10 / -0.20 mm
Max Aspect Ratio	8:1
Surface Treatment	ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold Finger, Selected Gold Plating, ENEPIG, ENIPIG
Impedance Controlled	Value>50ohm: ±10%; Value≤50ohm: ±5 ohm

Item	Attribute
Brand	CeramTec / GTT / Huaqing / Laird / Maruwa / Rogers / Toshiba
Base Material	AI2O3 / AIN / BeO / SiO2
Base Material Thickness( exclude conductor)	0.20mm / 0.25mm / 0.30mm / 0.38mm / 0.50mm / 0.635mm/ 0.76mm / 0.80mm / 1.0 mm/ 1.2 mm / 1.5mm / 2.0 mm
Thermal Conductivity	24w / 27w / 170w / 200w / 240W
Soldermask Type	Glass glaze , Soldermask oil (white , black , green , blue , yellow , red )
Tg Value	200 / 250 / 300 / 400 / 500 / 600 / 700 / 800
Halogen Free	Yes(optional)
Breakdown Voltage	11 – 34 KV/
Dielectric Constant(MHZ)	9 – 10
Water Absorption	0%
ROHS	Yes
Flammability	94V-0
Thermal Conductivity (W/m.K, or W/m.C)	Al2O3: >= 24; AIN: >=170; BeO: >=240; Si304: 16 – 22
Dielectric Strength	0.635mm; 11KV/mm; 1.0mm; 17KV/mm; 2.0mm; 34KV/mm
Wrap & Twist	≤ 0.75%

Prototype(<1m²)	Layers	Normal Service	Expedited Service
Ceramic PCB	1 Layer	Thick Film:3 – 3.5weeks DCB/DBC/AMB: 3 – 4 weeks DPC: 2 – 3 weeks	Thick Film:1.5weeks DCB/DBC/AMB: 2 – 3 weeks DPC: 1.5 weeks
	2 Layers	Thick Film:3 – 4 weeks DCB/DBC/AMB: 3.5 – 4.5 weeks DPC: 2.5 – 3.5 weeks	Thick Film:2 weeks DCB/DBC/AMB: 2.5 – 3.5 weeks DPC: 2 weeks
	4 Layers	Thick Film: 4 – 6 weeks	2.5 weeks
	6 Layers	Thick Film: 4.5 – 6 weeks	2.5 weeks
	8 Layers	Thick Film: 5 -7 weeks	3 weeks
	10 Layers	Thick Film: 6 – 8 weeks	3.5 – 4 weeks

Production	Layers	Normal Service	Expedited service
Ceramic PCB	1 Layer	Thick Film:3.5 – 4 weeks DCB/DBC/AMB: 4 – 5 weeks DPC: 4 – 5 weeks	Thick Film:1.5 – 2.5 weeks DCB/DBC/AMB: 2.5 – 3.5 weeks DPC: 2 – 3 weeks
	2 Layers	Thick Film:4.5 – 5.5 weeks DCB/DBC/AMB: 5 – 6 weeks DPC: 5 – 6 weeks	Thick Film:2 – 3 weeks DCB/DBC/AMB: 3 – 4 weeks DPC: 2.5 – 3.5 weeks
	4 Layers	Thick Film: 5 -6 weeks	2.5 – 3 weeks
	6 Layers	Thick Film: 5 -6 weeks	3 – 3.5 weeks
	8 Layers	Thick Film: 6 -7 weeks	3 – 4 weeks
	10 Layers	Thick Film: 7 – 9 weeks	4 – 5 weeks

Project Cases

Ceramic PCB for sensor for cars

Layer Count: 1 Layers
PCB Type: Ceramic PCB
Material: 96% Al2O3
Board Thickness: 0.635mm +/-0.1mm
AgPd Thickness : >=10um
Solder Mask: Glass Glaze

Ceramic PCB for communications

Layer Count: 2 Layers
PCB Type: Ceramic PCB
Material: AIN
Board Thickness: 0.56mm +/-0.1mm
Copper Thickness : >=90um
Surface Treatment: ENEPIG 3u”

Ceramic PCB for automobile industry

ayer Count: 1 Layer
PCB Type: Ceramic PCB
Material: 96% Al2O3
Board Thickness: 1.20mm +/-10%
AgPd Thickness: >=10um
Solder Mask: Greenish Glass Glaze

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